Used ENGIS JAPAN EJW-400IFN #9208870 for sale

ENGIS JAPAN EJW-400IFN is a state-of-the-art wafer grinding, lapping and polishing equipment. The unique design of EJW-400IFN utilizes intricate mechanical and digital control systems to provide consistent and repeatable flatness and uniformity to the processing of wafers. With ENGIS JAPAN EJW-400IFN, users can achieve a near-perfect surface finish, low surface roughness and high thinning rates to obtain the desired shape or pattern. EJW-400IFN is designed to provide operators with high precision and accuracy in wafer processing. It is constructed of stainless steel and other corrosion-resistant materials to ensure reliable and consistent performance. The system also incorporates an advanced spindle drive unit, ensuring a wide range of operation speeds without sacrificing precision. The internal air bearings keep the machine perfectly balanced when triggered by an electronic signal to start or stop the grinding or polishing cycles. ENGIS JAPAN EJW-400IFN is equipped with an automatic depth control tool that ensures uniform grinding depths for each wafer processed. With the asset's self-centering pressure controller and force monitoring capabilities, EJW-400IFN is able to constantly adjust the pressure applied on the wafer, based on the grinding characteristics. It also includes advanced vibration sensors to monitor the model at all times to protect the equipment from potential damages from frequency spikes. ENGIS JAPAN EJW-400IFN includes an ABS control box to monitor and control the entire system functions. The box is ergonomically designed to display relevant parameters with wide angle LCD screens and an intuitive keypad for easy operation. This is used to monitor process criteria such as grinding/polishing rates, profiles and surface roughness. Additionally, the unit is equipped with a safety interlock switch and video interface to further ensure the user's safety. EJW-400IFN is a considered to be a reliable and accurate machine for wafer grinding, lapping, and polishing. It offers the highest level of precision, control, and repeatability while operating at state of the art speeds, with accuracy and external control. With the use of advanced mechanical and electronic systems, ENGIS JAPAN EJW-400IFN offers users the highest performance and quality for all facets of wafer grinding, lapping, and polishing.