Used ENGIS JAPAN EJW-460SFN-ARSll #9208850 for sale

ENGIS JAPAN EJW-460SFN-ARSll is a high-performance wafer grinding, lapping and polishing equipment. It is designed to provide an efficient and precise solution for ultra-flat grinding, lapping and polishing operations of ultra precision wafers. The system features a monobloc design that incorporates all the machine sections into a single rigid body for superior accuracy and greater precision. It includes a patented looping stainless steel frame and a high speed precision transmission unit driven by digitally-controlled stepper motors. The frame is supported by laser-graded crossed roller guide ways which provides outstanding positioning accuracy for dynamic grinding and polishing applications. A built in headstock and tailstock allows for the efficient process of single side grinding, lapping and polishing of an entire wafer without having to turn it around. It also features two 5mm to 65mm grinding-wheels, two 25mm to 495mm lapping wheels, and one 200mm lapping-polishing arm, each with their own dedicated working platform. The wheels and the arm can be precisely adjusted by 0.1µm intervals for a range of different applications. The machine is also equipped with a high precision measurement tool that uses laser interferometers to measure the wafer profile in real-time. This is integrated with the grinding and polishing processes to provide accurate feedback on the wafer's performance and ensure optimum precision and accuracy. Other features include a high speed conveying asset, automated loading and unloading, sophisticated auto-protection systems to guard against emergencies, and a user-friendly HMI which allows for a convenient operation. Overall, EJW-460SFN-ARSll is an effective and reliable model for ultra-precision flat grinding, lapping and polishing of wafers. With its fast and accurate response, its high performance and its precise measuring equipment, it is able to provide superior results every time.