Used ENGIS JAPAN EJW-610IFN #9257669 for sale

ENGIS JAPAN EJW-610IFN is a versatile wafer grinding, lapping and polishing equipment designed for the fabrication of semiconductor materials. The system is ideal for research and development and high-precision processing. It is equipped with a computer-controlled, multi-axis grinding and lapping spindle that can precisely control wafer shapes and surface finish. EJW-610IFN also includes an advanced polishing solution and a diamond-tipped lapping tool that can handle a broad range of shapes and materials. The unit is designed to reduce or eliminate downtime due to vibration and static electricity. A static eliminating panel and precision-adjustable ball bearing slides ensure smooth, even operation and help protect wafers from damage. ENGIS JAPAN EJW-610IFN is designed for minimal energy consumption and features simple maintenance, making it cost-effective and reliable. EJW-610IFN is capable of precision grinding and lapping of semiconductor materials ranging from brittle ceramics and brittle silicon to optically transparent glass, quartz, and metals. It can also handle soft materials including trace metals, conductive fibers and dielectric layers. The precision of the process can be set to within less than one micron and have a sustained surface roughness of <5nm RMS. The machine is also equipped with a separate lapping station, which can be programmed to simultaneously lap wafers from two different angles, allowing for unmatched accuracy and repeatability. The lapping station can control angular adjustment, pressure, and speed. It is designed for easy loading and unloading of wafers and allows for simple setup and calibration, so users can quickly and effectively lap a variety of materials and shapes. ENGIS JAPAN EJW-610IFN is an advanced tool for precision processing of semiconductor materials. Its reliability, high accuracy, and low energy consumption make it an ideal choice for research and development applications. Its versatile design and simple operation also make it an ideal choice for high-precision wafer grinding, lapping, and polishing.