Used ENGIS JAPAN SSM36P #293666168 for sale

ENGIS JAPAN SSM36P is a professional wafer grinding, lapping and polishing equipment specifically designed to provide precise, high-quality results for wafer production. This advanced system is engineered to achieve superior surface finishes and flatness on both crystalline and non-crystalline wafer surfaces. SSM36P is equipped with a high-tech microprocessor-driven control unit, facilitating precise adjustment and set-up of grinding parameters. This machine is also equipped with Japanese-made servo motors for fine grinding and lapping steps, ensuring higher speed and improved precision in the production process. ENGIS JAPAN SSM36P includes an advanced vacuum tool that allows the user to achieve ideal vacuum settings for each wafer run, as well as efficient dust collection and evacuation of grinded material. In order to provide consistent and repeatable results, SSM36P is equipped with a large range of grinding tools, including diamond abrasives, silicon carbide and lapping plates. This asset also includes an array of advanced attachments for controlling the polishing pressure and speed, ensuring a uniform finesse and accuracy. An integral cooling model with water recirculation ensures that the equipment is always running at a convenient temperature, helping to maximize wafer yield. Additionally, ENGIS JAPAN SSM36P is equipped with advanced safety systems, making sure that all operators remain safe during operation. The versatility of the ENGIS SSM36P wafer grinding, lapping and polishing system allows users to easily select the desired process parameters (such as grinding depth, rotational speed, abrasive type, etc.) and carry out multiple operations in one cycle. This eliminates the need to start and stop the machine between operations, reducing production time and improving wafering efficiency. The unit is also equipped with a wide variety of tools and attachments, allowing the user to perform a wide variety of operations and yield consistent results every time.