Used ESTARTA 301 #9256587 for sale

ESTARTA 301 is a wafer grinding, lapping & polishing equipment engineered and manufactured by the Spanish company ESTARTA Solutions. This system is a compact automated solution capable of producing top quality results with a high degree of flexibility and efficiency. The unit consists of an adjustable grinding station accompanied by an automated lapping and polishing machine, both systems powered by an integrated brushless force motor to provide smudge free and uniform grinding & polishing processes. The grinding station is equipped with a tool spindle, an adjustable arm and software programmable milling head. It is designed to reduce processing time and reduce energy usage through the use of optimized grinding parameters and predetermined tool paths. The lapping arm of the tool is designed for both 'semi-abrasive' & 'non-abrasive' processes, allowing users to select the most suitable process for individual materials and application needs. The lapping process utilizes a patented lubrication asset to provide a uniform and homogenous surface on the work-piece, reducing possible abrasion and minimising cycle time. The polishing process also features a unique in-situ automated polishing model. This ensures optimised results in terms of material surfaces, while avoiding potential damage caused by handheld polishing tools. The equipment also features a variety of safety features to protect the operator and the environment. This includes an advanced filtration system that helps capture and collect any particles produced during the grinding and polishing processes, to reduce dust and debris. Further safety features include an elevated platform for secure loading, unloading and observation of the process, as well as adjustable speed settings for controlling the speed of the grinding & polishing processes. To ensure a consistently high level of quality and productivity, the unit also utilises an intuitive user interface and a software controlled process monitoring capability to ensure accurate and timely data collection and analysis. In addition, automated feedback controls help to guarantee reliable, repeatable results for multiple production runs. Overall, 301 is an ideal choice for wafer grinding, lapping & polishing applications. It offers a cost-effective solution featuring a high degree of flexibility and a wide range of safety and control features, making it a great choice for both experienced engineers or first time users.