Used EZCONN EZ 312 #9070784 for sale

EZCONN EZ 312 is an automated wafer grinding, lapping, and polishing machine that is widely used in the semiconductor industry. It is designed for precise grinding, lapping, and polishing of semiconductor substrates such as silicon wafers. The machine is ideal for processing 3", 4", 6" and 8" wafers that are up to 25mm thick. It is capable of performing grinding, lapping, and polishing steps in a single cycle, and can process up to three wafers at a time. EZ 312 features a multi-zone processing chamber, an ergonomically designed interface, and touch screen controls. This allows for easy operation of the machine, and also enables it to switch between different processes with minimal downtime. The lower chamber of EZCONN EZ 312 can house up to three wafers and is designed to provide uniform wear across the entire surface. The upper chamber houses the lapping and polishing components, which are designed to provide even polishing and consistent results. The lapping and polishing process is achieved with the use of diamond abrasives and bonding agents. These abrasives and agents are loaded into the upper chamber of EZ 312, and are dispensed uniformly onto the wafers. The bonding agents help to create a more uniform surface finish. The wafers are then subjected to a vigorous lapping and polishing process, and the results are monitored with the aid of a multi- axis vision system. The process is automated so that the user does not need to manually monitor the progress of processing. In addition to this, the machine is equipped with several safety features that are activated when the user is working with the equipment. This includes a "lock out" feature, which prevents the machine from being operated when the user is not present. EZCONN EZ 312 is built using high quality parts, and is able to provide consistently accurate and reliable results. This makes it an attractive and cost-effective choice for the semiconductor industry. Furthermore, its ergonomic design and user-friendly interface makes it easy to use and further enhances its appeal for semiconductor manufacturers.