Used FISCHIONE INSTRUMENTS 200 #9260155 for sale

ID: 9260155
Dimpling grinder Spare parts included.
FISCHIONE INSTRUMENTS 200 is a wafer grinding, lapping & polishing equipment designed for semiconductor, magnetic memory and MEMS device production. This system is used in semiconductor manufacturing technology to produce circuits with better electrical characteristics. The unit is highly efficient and offers high precision precision in processes like lapping, polishing, and grinding. The core components of 200 machine are its main processing unit and its load port assembly. The main processing unit offers varied features that make wafer processing easier and more efficient. The processing unit is equipped with a brushless DC motor and digital encoder for precise position control, a thermocouple-based temperature control tool, and a strainless steel work table for durable and reliable operation. Additionally, the main processing unit offers an adjustable speed range for operations, and can accommodate wafers of up to 300mm in diameter. The load port assembly consists of special loading and unloading mechanisms, height adjustable work supports, and a power supply with an output of up to 30A. FISCHIONE INSTRUMENTS 200 asset can be equipped with various grinding, lapping, and polishing tooling to enable customized processes. The tooling is designed to minimize material indentations and contamination. This model is also equipped with a dust collection equipment to capture and filter dust created in processes like lapping, polishing, and grinding. 200 platform is integrated with software that provides users with convenient tools to configure and manage processes. The software includes built-in automatic transport and rotation algorithms that are used to transport and rotate wafer parts during the grinding, lapping and polishing process. Additionally, this system is equipped with a noise-reduction unit that helps provide a quiet work environment. Overall, FISCHIONE INSTRUMENTS 200 machine is a reliable and efficient wafer grinding, lapping & polishing platform for high-quality semiconductor, magnetic memory and MEMS device production. It offers a range of features for precise control in operations and also includes dust collection, noise-reduction, and automation software for convenient management of processes.
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