Used FUJI 4B-4L-4WAY #9118980 for sale

FUJI 4B-4L-4WAY is an automated wafer grinding, lapping & polishing equipment designed to improve the surface finish and uniformity of semiconductor wafers. This system is capable of grinding, lapping & polishing up to 4 wafers simultaneously with accurately controlled parameters. The unit is equipped with a proprietary spindle drive machine and a full range of grinding, polishing & lapping accessories that make it suitable for a number of different production needs. The tool is constructed using a stainless steel frame with a vibration-free design for precise wafer positioning and alignment. The spindle is motor-driven and capable of speeds up to 13,000 rpm while generating 5kHr or less torque. A user-friendly operating console provides a simple and easy to use interface for various parameters, including grinding speed, grinding intensity and diamond slurry utilization. The grinding units are equipped with diamond wheels to provide the highest level of uniformity and surface finish on the processed wafers. The lapping stage utilizes a high-efficiency lapping plate and a variable number of lapping angles for precise lapping of the wafer. The polishing stage utilizes a specially designed roller which ensures uniform surface finish across the wafer. 4B-4L-4WAY asset is designed for long-term reliability and high productivity. The model is equipped with a variety of safety features, including an integral safety cylinder to prevent the wafers from damage in the case of a process overload or other malfunction. This equipment also comes with integrated software tools to analyze and monitor various process parameters on an ongoing basis to ensure quality control. FUJI 4B-4L-4WAY system is ideal for wafer processing applications where high precision finish, uniformity and high throughput are required. With its fully automated operation, ease of use and safety features, this unit is an ideal solution for any production line.