Used FUJI 4B-4L-4WAY #9224520 for sale

FUJI 4B-4L-4WAY is a state-of-the-art wafer grinding, lapping & polishing equipment used to grind, lap, and polish semiconductor wafers. It features a four-headed lapping station, four-way grinding wheel, four-headed polishing station, and a programmable control system. The unit's four-headed lapping station simultaneously rotates and moves all four lapping wheel heads, keeping them in uniform motion and constantly in contact with the wafer. It is designed so that the wafer will always be lapped in the same plane, allowing uniform distribution of material removal for perfect uniformity. The lapping head can be set to a high relief angle, allowing for controlled material removal that is free from any surface defects or roughness. The four-way grinding wheel combines four individual grinding heads, which rotate in opposing directions, allowing for a higher level of accuracy in grinding. The four individual grinding heads allows for an even grind throughout the entire wafer, ensuring a high degree of accuracy and material removal is achieved. The four-headed polishing station utilizes a polishing pad to hold the substrate in place, while the four-way grinding and polishing head spins in 360-degree orbits. This ensures uniform polishing across the entire wafer surface. A variable frequency drive is used to control the orbital speed, allowing the operator to adjust the polishing speed for optimal results. 4B-4L-4WAY machine also features a computerized programmable control tool to make operation easier. This asset allows for setting up process recipes, monitoring process information, controlling process parameters, troubleshooting and more. The user can edit, save and recall process recipes and monitor real-time data of the process, providing increased accuracy and repeatability. In total, FUJI 4B-4L-4WAY model is the perfect solution for any semiconductor wafer grinding, lapping, and polishing needs. It is capable of delivering extremely uniform surfaces, in both flatness and material area removal, through its user-friendly and accurate control equipment.