Used FUJI FSP-12B-5L #9224521 for sale

FUJI FSP-12B-5L
ID: 9224521
Vintage: 1988
Double side lapping machine Correction carrier No pump Slurry tank 1988 vintage.
FUJI FSP-12B-5L is a wafer grinding, lapping, and polishing equipment, designed to provide economical precision lapping and polishing for both industrial and research applications. The system combines the precision of FUJI newly developed 2.5 axis programmable motion controller with the benefits of a computerized interface. This advanced motion control allows for flexible speed control and single- or multi-directional motion profiles, enabling high precision grinding, lapping and polishing. The unit is compatible with a wide range of grinding, lapping and polishing tools, including diamond grit, to ensure that each application is correctly sized for the specific requirements. Each tool is designed to provide the utmost precision in the cutting and polishing of semiconductor materials. Furthermore, FUJI FSP-12B-5Lallows for jigging-up to twelve 2-inch (50.8 mm) wafers simultaneously, making it an ideal solution for cost-efficient and rapid production requirements. The machine has a working area of 200 mm x 100 mm x 80 mm (W x H x D), and is configured with a vacuum chuck and electro-mechanical lift. This configuration allows precise wafer handling, and provides a secure grip on the wafers for effective grinding, lapping and polishing. The tool includes a controller for both grinding and polishing, and an intuitive graphical user interface (GUI) for user control and monitoring. FSP-12B-5L is also equipped with a unique integrated filtration asset that traps grinding dust at the point of operation, saving time and greatly reducing the risk of contamination. The model has two inlet ports for vacuum and water valves, allowing users to customize the setup to best suit their application. Additionally, the equipment is vibration-free, encased in a conveniently-sized envelope, and designed for easy service access. In summary, FUJI FSP-12B-5L is a ground-breaking wafer grinding, lapping and polishing system that offers superior performance and flexibility for industrial and research applications. Its combination of advanced motion control, precision tools, integrated filtration unit, and intuitive GUI, makes it one of the most powerful and versatile solutions available today.
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