Used FUJI FSP-9B-5L #9118945 for sale

FUJI FSP-9B-5L is an advanced, innovative wafer grinding, lapping and polishing equipment. It is designed to produce ultra-precise, precise, and high-quality results for various polishing applications. The system features a small number of process chambers, ensuring that the processing of a single wafer is time efficient. The unit contains mechanical positioning, which allows individual chuck control for reliable results. FSP-9B-5L is a fully automated machine, with an integrated control unit. The tool's intuitive GUI allows for easy programming, giving the user complete control over every aspect of the grinding, lapping and polishing process. FUJI FSP-9B-5L utilizes a sophisticated grinding and polishing asset which is equipped with diamond tools. This ensures a high level of accuracy and uniformity of the results. The model also performs at a high lapping/polishing speed of up to 3000 rpm, allowing for quick completion of the process. FSP-9B-5L's innovative wafer grinding and polishing equipment features an integrated waterjet cooling system, which provides excellent cooling for the grinding and polishing tools. This ensures optimal process controls and decreased thermal damage to processed wafers. Additionally, the unit has a recovery and recycling machine for used abrasive materials, ensuring a clean work area and protecting the environment. FUJI FSP-9B-5L is equipped with a low-noise and dust-proof workroom, minimizing noise and dust contamination during processing. Furthermore, FSP-9B-5L is compliant with ISO 6336 and has a long service life due to its special-alloy construction. FUJI FSP-9B-5L is an excellent choice for research and manufacturing applications in semiconductor industries or for sample and device preparation operations in academic and industrial laboratories. This multi-functional tool ensures reliable, precise, and high-quality results. No matter the field, FSP-9B-5L's superior performance will help users obtain top quality results.