Used FUJI FSP-9B #9181274 for sale

FUJI FSP-9B wafer grinding, lapping and polishing equipment is a versatile, automated machine system designed for high speed, precision grinding, lapping and polishing of a variety of semiconductor, optical, and electronic hardware. The machine features six axis robotic arm which allows for precise movement of the wafer for different grinding, lapping and polishing operations. The robot is driven by a powerful stepper motor, with a built-in encoder and a programmable digital controller, to precisely control the robot's movement and to ensure it maintains its position. The robot also features a high speed video monitoring unit to ensure the workpiece is free of any scratches and deformities. The machine can be used for grinding, lapping and polishing of both thin and thick wafers. Its unique head mechanism can allow for simultaneous grinding, lapping and polishing of two thin wafers at the same time which increases throughput and production. The process control software allows for the input of a large variety of grinding, lapping and polishing parameters, such as grinding speeds, exposure time, and pressure, to ensure uniformity of the finished wafers. The machine is equipped with a powerful dust collection machine to protect operators and keep the machine clean. The machine also features a temperature-controlled environment to help maintain the stability of the grinding, lapping and polishing processes, and to prevent overheating or overstressing of the components. The machine is also equipped with a built-in safety tool to turn off the asset should there be any emergency such as a high temperature or any mechanical fault which may cause damage to the model. FSP-9B is a robust, cost effective, and a versatile wafer grinding, lapping and polishing machine for semiconductor, optical, and electronic hardware manufacturing. Its reliable and easy-to-use robotic arm, coupled with its powerful stepper motor and advanced programmable controllers, allows for precise and high speed operations with a high level of control. Its automated dust collection and temperature control helps maintain the safety and integrity of the equipment and the finished wafers.