Used FUJI Go #9190426 for sale

FUJI Go is a wafer grinding, lapping and polishing equipment that accommodates up to eight wafers simultaneously. It utilizes an overhead robotic arm to move the wafers, which can be processed on four different grinding and polishing discs that are mounted on a common spindle. The system is capable of grinding and polishing wafers of various thicknesses, as well as lapping wafers of different dopant concentrations and materials. The grinding and lapping discs are made of a high-abrasion-resistant material, which ensures a high degree of surface roughness on the wafers undergoing grinding. A vacuum hold down option is available, which allows wafers to be securely held in place during grinding and polishing. An alarm unit helps to monitor the wafer during processing. The machine features a built-in grinding and polishing program that makes it possible to input various parameters for each grinding and polishing cycle. These parameters include the speed of the grinding and polishing wheels, the amount of force to be applied, the amount of time necessary for each cycle, and the number of cycles. The program also stores information from previous sessions, allowing repeat processes to be carried out with minimal user input. The tool operates at a high processing temperature, which helps to reduce oxidation of the wafers undergoing processing. An integrated cooling asset prevents the grinding and lapping discs from overheating and helps to ensure uniform processing over the entire batch. The model also comes with automated sharpening of the grinding and lapping tools, allowing them to maintain their performance throughout their life. The equipment can be integrated with other wafer preparation systems, such as spin rinsing and dry etching systems, to provide a fully automated solution for processing wafers. Go wafer grinding, lapping, and polishing system is a reliable and cost effective solution for quickly and accurately fabricating semiconductor wafers for various applications. It's easy to operate and offers a consistent processing quality and repeatability, making it an ideal choice for semiconductor fabrication.