Used FUJI KOGYO 18B-5L #9276660 for sale

FUJI KOGYO 18B-5L is a wafer grinding, lapping and polishing equipment designed for precision processing of semiconductor wafers. This system was developed to provide accuracy and reliability during the production of devices such as transistors and diodes. The unit consists of an independent motorized grinding and lapping unit with a grinding wheel diameter of 350mm. The machine also has a motorized polished platen that is specifically designed to provide low-force grinding and polishing. The machine has a control panel that enables the user to control the machine's operation. A vacuum table is also included in the machine. This table is used to hold the grinding fixtures during the grinding and polishing process. The vacuum table also helps in preventing dust and debris from centralizing on the surface of the wafers. The machine also has a grinding spindle that is able to rotate at variable rpm in order to suit each application. This tool is equipped with a water cooling asset that helps to keep the working temperature low and ensure better thermal conductivity. A built-in LED alarm warns the user in case of an abnormal situation. It also has an auto-stop function that prevents the machine from running after a specific period of time. The model also features a particle detector, which is used to detect the size of the particles created during the grinding or polishing process. The detector is sensitive enough to detect particles as small as 1 micron. This is useful in knowing the degree of grinding or polishing and in detecting possible defects that are difficult to see with the naked eye. 18B-5L equipment is designed to be efficient in high precision grinding, lapping and polishing of wafers. It features a robust design and user friendly controls. It also has built-in safety features that ensure the operation is safe and reliable. This system is ideal for use in applications involving precise processing of semiconductor devices.