Used FUJI KOGYO 9B #9276655 for sale

FUJI KOGYO 9B is an advanced wafer grinding, lapping & polishing equipment that features the latest in wafer grinding and lapping technology. The system is designed to perform precise grinding and lapping of wafer discs and other planar objects from a wide range of materials such as silicon, glass, and ceramic. Using the state of the art in grinding and lapping technology, 9B produces high quality and precision surfaces on wafer discs and other flat substrates. FUJI KOGYO 9B unit consists of a spindle, grinding wheel, and a range of other components to ensure a fast and precise grinding process. The spindle is a powerful high-speed motor assembled into a rigid box frame that is then connected to a grinding wheel placed in the center of the frame. This spindle and wheel combination is capable of grinding wafers and other substrates at 4000 revolutions per minute (RPM). 9B is equipped with an arrissing stylus that can accurately and quickly adjust the grinding wheel and reach a specific depth and volume for intaglio grinding. FUJI KOGYO 9B machine is also equipped with a lapping station that is capable of producing a high quality finish on the substrate. This lapping station utilizes diamond plates that have been bonded with silicon carbide to enhance the lapping quality of the substrate. The diamond-plated silicon carbide lapping plates move in a circular motion to ensure consistent and precise lapping of the wafer's surface. Using this advanced lapping tool, 9B can produce a precision finish on the wafer substrate while also minimizing warpage or distortion. FUJI KOGYO 9B also features a polishing station that is equipped with a carousel turret to ensure precision polishing and a variety of pads to give a consistent finish to the substrate. These polishing pads are available in different sizes and materials to ensure an appropriate coating for the substrate. The polishing station moves at a speed range of 50 to 1500 revolutions per minute (RPM) to ensure a precise and reliable finish. 9B asset is a highly reliable and efficient wafer grinding, lapping and polishing model. The advanced technology incorporated into the equipment allows for precise, consistent and efficient operation. By utilizing FUJI KOGYO 9B system, surface measurements and flatness of the wafer remain consistently accurate and the quality of the finished substrate is high.