Used FUTURE TECH FM-ARS9000 #9280857 for sale

FUTURE TECH FM-ARS9000 is a comprehensive wafer grinding, lapping and polishing equipment designed for advanced semiconductor manufacturing. Developed by FUTURE TECH, FM-ARS9000 is the perfect all-in-one solution for large scale production of sophisticated wafer products. The system consists of two independent grinders, a polisher, and a lapping machine that runs in parallel to provide a comprehensive processing solution. The grinding heads are adjustable to accommodate multiple wafer sizes and a variety of grinding and polishing operations. The machine also features two separate programs for grinding and lapping, which allow for precise control over the material characteristics and uniformity of the wafers. The polishing station also features adjustable speeds and pressure levels to create the desired surface finish for a variety of materials. FUTURE TECH FM-ARS9000 is designed for rapid wafer processing with high precision. It uses a closed loop unit for precise control over all machine parameters so the results are always within the desired specifications. As well, the machine has an optional precision measurement machine and integrated inspection software to verify the quality and characteristics of the wafers produced. To ensure maximum safety, FM-ARS9000 is designed with a calibrated dust collection port for protection against airborne particles. Additionally, the machine is designed to be easily maintained and necessary preventive maintenance is accomplished quickly and easily. Overall, FUTURE TECH FM-ARS9000 is an advanced wafer grinding, lapping, and polishing tool with advanced technology, excellent flexibility, and maximum safety. Its capabilities make it the perfect solution for large and small scale semiconductor production, as well as a variety of other industrial applications.