Used G&N MPS 2-134 #9227858 for sale

G&N MPS 2-134 wafer grinding, lapping and polishing equipment (MPS 2-134) is an innovative product designed for grinding and polishing of integrated circuit (IC) and substrate wafers. This system consists of a combination of different peripheral components that enable a high degree of process accuracy, repeatability and throughput performance. The unit is designed for ultra-precise fabrication of wafers for the highest semiconductor manufacturing requirements. G&N MPS 2-134 offers a unique, robust and reliable process for wafer grinding and polishing. The machine is equipped with a two-stage grinding/polishing unit, consisting of a grinding wheel and a polishing pad. The grinding wheel is made of diamond or cBN abrasives. It is designed for high speed grinding of thin as well as thick wafers with great accuracy and repeatability. The second stage is a chemical/mechanical (CMP) buffing process for polishing the surface of the wafer. The polishing step is executed using a polishing slurry appropriate to the material and characteristics of the wafer. MPS 2-134 provides precise control over the grinding and polishing processes. The unit has automatic gap adjustment capabilities and is capable of measuring the gap width between the grinding wheel and the wafer to ensure an optimum process accuracy. This feature also helps to set the optimum process parameters for the particular application. The unit also includes advanced process control using the distributed control tool (DCS) architecture, allowing for remote monitoring and control of the grinding and polishing process. G&N MPS 2-134 also offers an enhanced safety feature for the operator, as the asset is equipped with an automated protection model and emergency stop circuit. This feature helps to protect the user from any potential accidents during the use of the equipment. To maximize the efficiency of the grinding and polishing processes, MPS 2-134 utilizes a unique buffing slurry and buffing pad holder. The holder, which is equipped with a motorized equipment, allows for quick and easy loading and unloading of the pads and slurry containers. This feature eliminates any potential time losses during the changeovers of the slurry and pad, thereby enhancing the productivity, throughput and process repeatability. Overall, G&N MPS 2-134 is an innovative system designed to meet the demanding needs of semiconductor manufacturing. The unit provides a uniquely robust and reliable control over wafer grinding, lapping and polishing processes, ensuring the highest quality wafers for the most advanced applications.