Used G&N MPS 2 R300 #9000439 for sale

G&N MPS 2 R300 is a wafer grinding, lapping, and polishing system, specifically designed for machining monocrystalline semiconductor substrates such as silicon, GaAs, and InP. The machine uses a modular, semi-automated production process for precision diamond grinding, lapping, and polishing of these substrates. The machine is equipped with three distinct wet processing modules, each one dedicated to a specific stage of the process, and each module equipped with individual features that make them highly adaptable to a range of needs and applications. G&N MPS2-R300 is a single-wafer in-line system with a motor-driven, three-stage roller conveyor, providing precise grinding, lapping, and polishing in a single unit. With these features, the machine provides high process speeds and superior wafer handling, accuracy and repeatability. The grinding module is a single-wafer machine with a specially designed grinding head which precisely controls diamond grinding wheels. This module provides high precision grinding for a range of different substrates and is used to machine geometries to a diameter down to 5 mm as well as irregularly shaped substrates up to 200 mm. The lapping module incorporates a precision-controlled lap tray, with various abrasives and carriers for operation. This module is used to create uniformity of surface characteristics to produce the required specification in the finished wafer. The polishing module is similar to the grinding and lapping modules, and uses the same motor-driven carrier and rotary table. This module utilizes diamond polishing pads of numerous gradations to produce highly polished surfaces on the substrate. In summary, MPS 2R300 is a wafer grinding, lapping, and polishing system that is specifically designed for semiconductor substrates such as silicon, GaAs, and InP. This ergonomically designed machine provides a modular, semi-automated production platform for precision grinding, lapping, and polishing of these substrates, achieving high process speeds and superior wafer handling, accuracy and repeatability.