Used G&N MPS 2 R300 #9229189 for sale

G&N MPS 2 R300 wafer grinding, lapping & polishing equipment is a fully automated tool for processing a wide range of substrates. It is designed to achieve the lowest possible surface roughness and homogeneity. The system is self-sufficient and features automatic grind-polish-clean-post conditioning cycles to rapidly produce high quality, low defects surfaces. The machine includes an integrated dummy wafer loading unit, allowing for rapid loading and unloading of multiple wafers simultaneously. The dummy wafer loading machine is especially beneficial when processing production lots with complex shapes and sizes. Depending on the size and shape of the wafer, the machine automatically adjusts feed speed and the grinding wheel pressure. G&N MPS2-R300 also includes an onboard high-precision turning platform to accurately rotate and position the wafers prior to lapping. A high efficiency vacuum chuck for efficient lapping completes the tool. The lapping section of MPS 2R300 uses two separate diamond lapping segments, one static and one mobile. This allows for lap size adjustment through servo-feedback control. The lapping segments apply precise pressure on the surfaces during grinding and lapping. A special pump asset filters the air, keeping the gap between the mobile and static lapping segments always within precision specifications. MPS 2-R300 polishing section uses a fixed multi-tier polishing model for effective and uniform polishing. Substrates are supported on a felt pad while the polishing is done by a controlled CDA-CNC polishing wheel. The polishing wheel is tempered to provide optimal flatness and surface accuracy. G&N MPS 2-R300 also includes an integrated post conditioning cycle for final processing. The cycle is designed to provide the highest precision flatness. The cycle is completed by the automated return of the wafer substrate to its original position and quality of each wafer is measured. G&N MPS 2R300 wafer grinding, lapping & polishing equipment provides a complete and very efficient solution to process high-precision wafers and substrates. It is suitable for high-volume production, with superior surface accuracy and quality.