Used G&N MPS 2 R300 #9386974 for sale

G&N MPS 2 R300 is an advanced wafer grinding, lapping and polishing equipment for semiconductor processing. The system offers single-machine processing and is designed for processing challenges that require high precision and accuracy. The R300 has a wide process range, from rough grinding to ultra-fine polish, and is capable of handling sizes from 75mm up to 300mm of various substrates such as silicon, sapphire and quartz. The machine's body is composed of a rigid hexagonal base made of stainless steel, to ensure stability and minimize vibrations. Its advanced abrasive feeder unit brings automatic abrasive feed to the desired location. The machine also has a pneumatic wafer clamping machine combined with the in-situ wheel conditioning enabling the adaptation of specific grinding processes for each material processed. An auto-height adjustment compensates for height differences between the mounted components, providing added accuracy to the processes. The grinding, lapping and polishing process is managed by a WinBoard Plus Computer-Controlled Tool, a multi-task operating software optimized for up to 6 stages which can be configured for one or multiple recipe programs. This asset provides operators with various parameters such as the process speed, contact pressure, power, downtime, throughput, temperature and current. These parameters can be monitored and adjusted in real-time, providing users with direct feedback and high-level automation. Additionally, the coated carbon fiber grinding wheel's unique material properties mean that grinding is more consistent, faster and requires less force. The combination of these factors, when coupled with a dust-free work environment, ensures that the process produces superior quality results in the most time and laboratory efficient manner. Finally, the ergonomically designed user interface features a powerful LED-illuminated display, intuitive navigation keys and a comprehensive performance statistic panel enabling quick setup and operation. This advanced model offers an enriched grinding experience to processors and lets users produce high-end solutions while increasing their production efficiencies.