Used G&N MPS 3-132 #9227857 for sale

G&N MPS 3-132 is an advanced modern wafer grinding, lapping and polishing equipment developed and manufactured by G&N (Groepler & Narly) for achieving optimum surface precision for semiconductor wafers. The machine promises to enhance the efficiency of the wafer manufacturing process by grinding, lapping and polishing the wafers to the exact surface specifications for the semiconductor / IC industry. It is suitable for grinding and lapping devices such as gallium arsenide (GaAs) wafers, silicon (Si), ferrite (NiFeSi), quartz (SiO2), sapphire (Al2O3), diamond (C) and many other materials. MPS 3-132 system is based on a three step process. The first step is the grinding which involves the use of diamond grinding wheels to reduce the wafer's dimensions to specific specifications. It also has a cooling unit included in this step to ensure that the wafer's cutting temperature remains within the specified range. Next, a lapping step polish the wafer surfaces in order to achieve a predetermined shape and level of surface evenness. This is achieved by applying a series of successive lapping operations with different abrasive grits. Finally, the polishing step completes the process and results in a mirror-like finish on both sides of the wafer. The machine consists of a control unit, grinding and lapping machine, and polishing machine. The machine body is designed to provide a stable and vibration-free working environment. It also contains a manual turret for easily switching between grinding and polishing wheels. Additionally, it is equipped with a Double Floating Lapping and Polishing device for simultaneously processing two wafers. It also has a Fast Return Tool for precise positioning and alignment of the wafers, and a special coating asset for protection of the polishing surface against dust and contamination. G&N MPS 3-132 machine is constructed with high grade components and utilizes modern manufacturing technologies. It also has a high precision design and construction which ensures complete control and accuracy throughout the wafer manufacturing process. Moreover, this model is very easy to configure and use making it suitable for both small and large production environments. The overall design of the equipment is such that it can work with different wafer sizes and materials allowing for flexible production runs. In summary, MPS 3-132 is an advanced precision system for wafer grinding, lapping and polishing offering maximum flexibility and superior results with excellent finish and accuracy.