Used G&N MPS 3-134 #9148732 for sale

G&N MPS 3-134 wafer grinding, lapping & polishing equipment is designed to provide a precise, repeatable planar grinding, lapping and polishing of semiconductor wafers. This system can Grind, lap and polish a wide variety of wafer sizes, shapes and materials. The wafer size range it will process is from 58.75 to 137.16mm in diameter. The 3-134 provides a variable speed main drive motor, ranging from 10 to 30RPM. This allows the user to select the grinding speed to suit their requirements. The platen, or grinding plate, features a variable-pressure spring unit to allow the operator to adjust the grinding force. This ensures a consistent surface finish and uniform thickness. The lapping parameters are equally adjustable in the lapping station. A lapping head is equipped with a variable speed motor to rotate the lapping plate at an adjustable rate. A liquid slurry, which supplies the abrasives, is fed through a precision spray manifold that ensures a uniform distribution of abrasive throughout the lapping process. Additionally, a presoaking mechanism reduces the wear on the lapping plate. The polishing station is equipped with a variable speed motor to hold the polishing plate at an adjustable rate. The head, which is pressurized by a pneumatically actuated mechanism, is used to apply the polishing force. The polishing station helps to polish away the scratches and residual surface defects from the grinding and lapping processes. For simple and consistent operation, the machine is equipped with a programmable logic controller (PLC) and two touchscreen controls, allowing the user to save parameters into the controller memory for repeatable processes. To ensure the highest possible quality of the wafer's surface finish, the control tool is also attached to a digital surface analyzer which provides a real-time analysis of surface characteristics. MPS 3-134 provides a complete grinding, lapping and polishing asset for efficient production runs. It is suitable for both high pressure and low pressure applications and can process wafers with thicknesses up to 15 millimeters. With its precision controls, it yields consistent results and eliminates time-consuming trial-and-error processes.