Used G&N MPS 3-135 #9199459 for sale

G&N MPS 3-135 Wafer Grinding, Lapping & Polishing equipment is a powerful and versatile system for a variety of precision surface finishing operations. It features a wide variety of capabilities, including high-precision grinding, lapping, polishing and honing of wafers up to 135mm in diameter. The unit is designed to offer a high-precision, low-cost solution for production of microelectronics, optics and other optoelectronics components. MPS 3-135 utilizes precision CNC-driven grinding/lapping wheel oscillations to produce high-quality, uniform finish surfaces on wafers. Its robust construction and enclosed CNC controller deliver repeatable, consistent results in a safe, temperature-controlled environment. Its versatile design offers a wide range of process capabilities, including single-side grinding, lapping and polishing, as well as double-sided lapping/polishing. It also offers the option for integration into customized, fully automated systems. G&N MPS 3-135 is equipped with a spindle assembly designed to support a wide range of abrasive materials. It features a variable-speed lapping/polishing wheel, adjustable lapping/polishing force, and a computer-controlled feed machine. It offers flexible programming, from full-automatic to manual operation. The tool is easy to operate and provides consistent results for a wide variety of materials, including diamond, glass, silicon, quartz, ceramic, sapphire, and other similar materials. MPS 3-135 is a reliable and user-friendly asset, ideal for high-precision finishing operations. It provides powerful and efficient operation for single and double side lapping/polishing of wafers up to 135mm in diameter. Its robust construction ensures repeated, consistent results without sacrificing accuracy. With minimal maintenance, G&N MPS 3-135 can provide reliable performance for a variety of microelectronics and optoelectronics applications.