Used G&N MPS 3H132 #9199454 for sale

ID: 9199454
Vintage: 2005
Grinding machine For silicon ingots 2005 vintage.
G&N MPS 3H132 is a state-of-the-art wafer grinding, lapping and polishing equipment made by G&N, the leading manufacturer in the industry. It is capable of high accuracy and finished surface quality for a variety of different materials including silicon, sapphire, zinc oxide, gallium arsenide and more. The 3H132 features a versatile modular design that allows for a wide range of processing tasks and capabilities, such as non-contact grinding, lapping, double-sided polishing, single-side planarization, and post-process cleaning and drying. The fully automated system is capable of high speeds for increased throughput even when handling multiple wafers. The 3H132 offers a powerful and robust solution for full-scale wafer grinding, lapping and polishing. Its modern angular design features stainless steel frame construction, pressurized rollers, digital high speed drive, hydraulic unit for controlling wafer rotation speed, and a series of specialized high-precision tool/arm combinations for grinding and lapping needs. The modular design allows for customized applications, such as for high-demand double-sided polishing, single-side planarization, and post-process cleaning and drying. The 3H132 wafer grinding, lapping and polishing machine is capable of performing a wide range of operations with incredible speed. The tool is able to rotate the wafers up to 15,000rpm, while also applying pressure and uniform grind to each side for simultaneous lapping. The asset's precision motion control allows for a high-accuracy finish, and a unique force-feedback feature provides additional feedback to the operator on the process. The 3H132 offers a closed-loop model with integrated safety features that prevent operational issues. The equipment incorporates a ground loop feature that senses any potential problems such as lodged particles or broken grinding wheels, and shut down operations as needed. Additionally, the 3H132 includes air channel cooling, making sure that all components maintain a stable operating temperature even during extended runs. In conclusion, MPS 3H132 offers an advanced and efficient solution for wafer grinding, lapping and polishing. It is an exceptionally dynamic machine, capable of performing a variety of processes with high speed and accuracy. The integrated safety features make it an outstanding choice for the modern workplace, and its highly customizable design allows for the process to be easily tailored for the needs of any user.
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