Used G&N MPS 3H132 #9199461 for sale

G&N MPS 3H132 is a highly advanced wafer grinding, lapping, and polishing equipment developed by Technica G&N. Designed to meet the stringent demands of the semiconductor industry, the system boasts superior processing performance thanks to its integrated drive unit, Spindle 400. The machine's grinding spindle is powered by a powerful and precise direct-current motor with a maximum output of 7.5 Kw, allowing for accurate surface processing of wafers. This motor is further enhanced by a unique 6-roller bearing tool, along with cooled sleeve bearings. This ensures that the grinding spindle operates reliably for long periods of time with a minimum of wear. The asset also utilizes an advanced lapping stage, a subsystem of the wafer grinding and polishing process. This stage helps to ensure that the surface of a processed wafer is smooth and uniform, with a more consistent surface finish. For this purpose, the model utilizes G&N gold plated three-roller lapping technology. During the polishing stage, an integrated 7-axis drive equipment with tilt and rotation capabilities locally adjusts the abrasive media on the wafer's surface. This allows for superior polishing performance as the speed and pressure exerted by the media can be precisely altered. Finally, the integrated process control system of MPS 3H132 provides the operator with a comprehensive overview of the unit's operation. This allows them to quickly adjust and optimize parameters during the process. Overall, G&N MPS 3H132 is a highly advanced wafer grinding, lapping and polishing machine with superior precision and repeatability. Thanks to its integrated direct-current motor and advanced process control tool, it is capable of performing at high speed and with a minimum of wear. This makes it the perfect choice for the processing of the most exacting semiconductor applications.