Used G&N MPS 940 #9170566 for sale

G&N MPS 940 wafer grinding, lapping & polishing equipment is a robust, automated unit that is ideal for preparing wafers in microelectronics applications. This precise multi-stage machine is designed to precisely remove material from the surface of a workpiece or substrate to a desired level of flatness. MPS 940 combines grinding, lapping and polishing in one system, using both wet and dry processes for maximum precision. The unit features a multi-spindle grinding head for increased throughput, a universal loading platform for various workpiece sizes, an integrated cooling machine, and highly adjustable programmable parameters. G&N MPS 940 utilizes a grinding-lapping-polishing (GLP) technology that efficiently removes material and produces superior surface flatness. It utilizes a digital motion controller that controls both the grinding head and the lapping or polishing head. The adjustable programmable parameters allow for a repeatable, consistent grind, lap or polish regardless of the size or shape of the workpiece. To ensure accuracy, the tool is equipped with CCD vision asset as well as a digital imaging model for precise determination of surface flatness and critical dimensions. MPS 940 is ideal for preparing workpiece surfaces in a variety of microelectronic applications. Its adjustable settings and robust design make it an ideal solution for processes such as CMP, CNC machining, thin film deposition, metalization, and lithography. In addition, it can be used for light grinding, lapping, and polishing. It can be used in a range of applications, as diverse as wafer fabrication, optical and waveguide production, and silicon wafer lapping and polishing. Furthermore, G&N MPS 940 is a cost-effective solution compared to other grinding, lapping, and polishing processes. As it doesn't require a significant investment in process time or tooling, the equipment is suitable for both small- and large-scale operations. Finally, MPS 940 is equipped with an advanced safety system that helps to minimize operator injury by monitoring torque strength in each process and controlling the speed of the grinding head. This ensures the utmost safety while operating the machine.