Used G&N MPS2-R300 DCS #9386983 for sale

G&N MPS2-R300 is a wafer grinding, lapping and polishing equipment designed to efficiently process a wide range of wafer applications. The system employs an automated linear multi-axis motion control unit to ensure accuracy and repeatability in its operations. The machine is equipped with a 400 mm diameter diamond grinding wheel that is configured for smooth and precise grinding providing up to 0.75 micrometer class finishes. The wheel is driven by a single, 24kW high-speed spindle enabling the wheel to reach 200RPM and able to generate up to 30Nm of torque. Its speed stability is ensured by a VFD and high-precision micro-stepping motor to prevent wheel run out. The lapping and polishing capabilities of the tool are fine tuned to produce a high-quality finish with minimal manual requirements. Its lapping asset uses a special multi-layer pneumatic pad and an adjustable base with a low-speed rotary table and live head liners. This results in a uniform wear of the liners, enabling higher cupping and limiting the break edge. The model also features a flexible polishing chamber, which can be quickly and conveniently exchanged without opening the chamber cavity. This gives the user the flexibility to process different wafer flavors, such as single-component or multiple-component, without compromising on the component quality. In addition, the equipment is designed with safety in mind and is built according to the latest safety standards, installing a safety door and a safety switch. This enables the operator to apply wafers safely and quickly, allowing for a significant reduction in cycle time. G&N MPS2-R300 is an exceptional system for precise grinding, lapping and polishing of wafers, providing the user with reliable and repeatable performance. Its high-end components and high-precision motion technology make it the perfect choice for a wide range of wafer processing applications.