Used G&N V400 #9208430 for sale

G&N V400 Wafer Grinding, Lapping and Polishing Equipment is a powerful and highly efficient machine designed for wet- and dry-grinding, lapping and polishing of silicon wafers up to 8" diameter. The system is composed of an enclosed stainless steel grinding tank, with integrated circulation and filtration systems, a vertical motor-driven base plate, and an upper polishing platen, all connected to the computer-controlled main controller. The unit operates using a unique 3-axis motion machine, consisting of a vertically orientated motor-driven base plate, for rotation and tilt adjustment, and an upper polishing platen, providing a precise lateral and radial movement. The motion tool provides a highly accurate and precise grinding and polishing result. The polishing platen is equipped with a precision air bearing for vertical rotation of the wafer. The wafer grinding process is controlled via a dedicated control unit which allows the user to adjust the parameters such as grinding speed, pressure, time and shape of grinding stone or pad. The asset is also equipped with a high-precision touch probe to ensure accurate surface roughness measurements can be taken during the grinding process. The model can be further equipped with a range of accessories designed to improve productivity. A rotating turret-style lifting equipment is available, which provides quick and easy loading and unloading of the wafer into the grinding tank. A vacuum fixture system is also available for perfect alignment of the wafer. V400 Wafer Grinding, Lapping and Polishing Unit is a highly efficient and precise production machine suitable for a range of thin-film and wafer applications. The fine control and easy loading and unloading capabilities make the tool ideal for batch processing, providing excellent quality and productivity.