Used G&P TECHNOLOGY Poli-400L #9067708 for sale

G&P TECHNOLOGY Poli-400L Wafer Grinding, Lapping & Polishing System is a specialized all-in-one machine designed for processing semiconductor wafers to extremely fine tolerances. By integrating all of the grinding, lapping and polishing components, Poli-400L delivers superior results for processing wafers across a variety of applications. It is suitable for processing any size of wafer, from 4" to 300mm. G&P TECHNOLOGY Poli-400L is designed to perform simultaneous grinding, lapping and polishing of two wafers of the same diameter. It features two separate spindle motors for each grinding, lapping and polishing process. The motors are designed to provide uniform speed and power so that the process is always consistent. The spindles are adjustable to ensure the best results based on the size of the wafer being processed. The machine is also equipped with vacuum vacuuming capabilities to avoid potential contamination. It has an adjustable vacuum pressure range of up to -80 kPa, along with an optional water misting system to prevent build up of dust particles. In terms of grinding, Poli-400L offers both grinding plates and grinding abrasives. It comes with an array of grinding abrasives that includes diamond, silicon carbide, aluminum oxide and other materials. The grinding plates feature a variety of shapes and sizes to achieve the desired surface roughness and flatness. For lapping, G&P TECHNOLOGY Poli-400L delivers superior results with its lapping plates that can rotate up to 6000rpm. Its lapping plates can feature a variety of shapes and sizes for maximum effectiveness and can be used for wafers up to 300mm in size. Polishing is done with the use of polishing pads and slurry that is fed directly into the polishing chamber. The polishing chamber is designed to efficiently capture the slurry and created an even, uniform surface finish. The slurry is an aqueous abrasive solution containing either diamond or alumina abrasive particles, depending on the wafer size. The machine also features an intuitive touch screen display for easy access to all the polishing parameters. This includes grinding speed, grinding angle and force, and lapping pressure, rotation speed and angle, as well as the ability to adjust and record all of the polishing parameters. Poli-400L is specifically engineered to provide superior results when it comes to grinding, lapping, and polishing of wafers. It offers uniform power, adjustable spindles, vacuum vacuuming, adjustable grinding and lapping plates, and polishing pads and slurry for maximum efficiency. This machine is the perfect solution for anyone looking for superior wafer processing results.