Used G&P TECHNOLOGY Poli-500 #9067710 for sale

G&P TECHNOLOGY Poli-500 is a wafer grinding, lapping and polishing equipment designed for the production of high-quality, ultra-smooth and perfectly flat surfaces on materials such as semiconductor, metals and composite substrates. The system is capable of processing a range of substrates up to 200mm in size, with a range of thicknesses between 0.2mm and 6.0mm. Poli-500 is equipped with a grinding module, featuring a high-precision gear drive spindle and motion unit. It is capable of high precision grinding and lapping for the production of smooth and perfectly flat wafers. It also features a diamond grinding wheel and diamond abrasive belt that can be used for end-polishing. G&P TECHNOLOGY Poli-500 also features can produce up to 48 overlapping spots for the surface polishing. Poli-500 is designed with an adjustable polishing pressure and angle value. This enables it to precisely and accurately control the polishing process and prevent any trace scratches on the surfaces. The machine also features a real-time polishing process control, allowing it to monitor and to precisely control the polished surface conditions. G&P TECHNOLOGY Poli-500 is also designed with automated loading and unloading functions, allowing for a more efficient and continuous production process. The tool has a four-multistage water rinse, to keep production components clean and to prevent contamination from the grinding and polishing process. Poli-500 is designed to be easy to use and maintain. The asset also features a graphical user interface that allows the operator to easily customize the model settings and parameters. It also features an internal alert and warning equipment, which allows the operator to be immediately informed about any abnormal conditions or errors. G&P TECHNOLOGY Poli-500 is an advanced and highly efficient wafer grinding, lapping and polishing system. The unit is designed for the production of high-quality, ultra-smooth and perfectly flat surfaces on a range of substrates. It features a range of features, such as automated loading and unloading, adjustable polishing pressure and angle values, real-time polishing process control, a four-multistage water rinse, and an easy-to-use graphical user interface.