Used G&P TECHNOLOGY Poli-762 #9067711 for sale

G&P TECHNOLOGY Poli-762 polishing equipment is a versatile and automated machine designed for the precise grinding, lapping and polishing of high precision IC and MEMS materials. Poli-762 is capable of maintaining extremely high accuracy finishing on wafers of various sizes and thicknesses. G&P TECHNOLOGY Poli-762 utilizes a two-stage direct drive system providing unmatched precision and repeatability, with the ability to produce finish and polish up to the very finest of detail. The machine delivers ultra-fine detailed and even surface finish, gently abrading material with low-abrasion lapping paper and polishing pastes, providing a highly polished surface on any type of substrate. Poli-762 can be custom set-up with the desired configuration in order to achieve the most precise finishing attributes. Its adjustable vacuum systems and centering devices are paired with a robust unit-integrated fully programmable logic controller (PLC) that controls all machine functions, ensuring a uniform and consistent finish. The PLC also enables the tool to operate in fully-autonomous, semi-autonomous and manual operating modes for increased control and accuracy. G&P TECHNOLOGY Poli-762 incorporates a compact design that requires minimal maintenance and set-up, with an optimized airflow asset for added protection from airborne particles, providing an ideal environment for the production of high precision IC and MEMS components. The end result is a superior and consistent finish and smooth surface on these materials. By combining its advanced PLC control model, multiple processing axes and its efficient motion, Poli-762 is capable of delivering increased performance, simplified set-up and operator safety, making it the ideal wafer grinding, lapping and polishing solution for modern IC and MEMS manufacturing.