Used G&P TECHNOLOGY VS-700 #9185065 for sale

ID: 9185065
Polishing machine 7.5 HP 800-2400 RPM 6" Shaft 10" Wheel.
G&P TECHNOLOGY VS-700 is a multi-functional wafer grinding, lapping, and polishing equipment with an innovative planetary design. VS-700 incorporates several standard design features that dramatically improve the overall level of performance when compared to other similar systems available. G&P TECHNOLOGY VS-700 has the ability to grind, lap, and polish wafers up to a 150mm diameter. The system is powered by their proprietary servo drive unit and bears a 3-year warranty against manufacturer defects. It comes standard with both a 4-position workhead and a 4-axis spindle, as well as a full complement of grinding, lapping and polishing tools. The workhead and spindle have adjustable speeds and both have sensors for precision accuracy. VS-700 is built with a heavy duty frame constructed from Annealed Alloy Steel for maximum durability. An equipped dust collection machine enhances the performance of the grinding, lapping, and polishing operations, while its unique multi-wrinkle belt tool increases efficiency and accuracy. Its lid is made of a shatter-proof polycarbonate plastic and can be opened, closed or secured from the inside. G&P TECHNOLOGY VS-700 provides various software programs designed to simplify operation and help maintain optimal results. Its user-friendly programming ensures easily adjustable feed rates and power range settings. It is also capable of the stationary grinding of wafers and can accept standard International Wafer Grinders and Lappers. For safe operation, VS-700 is equipped with several basic safety features including an emergency stop switch, an audible feedback alarm, a non-contact sensing lever device, and an automatic shut-off asset. The machine also includes an overdrive protection model that will automatically shut off the drive equipment if it reaches operating speed settings that are beyond the set limits. Overall, G&P TECHNOLOGY VS-700 is a good choice for anyone looking for a reliable, accurate, and multifunctional wafer grinding, lapping, and polishing system. Its customizable features make it a powerful and versatile machine that can meet the requirements of any application.
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