Used GEIBEL HOTZ FS 60 Compact #9066955 for sale

GEIBEL HOTZ FS 60 Compact is a highly advanced wafer grinding, lapping and polishing equipment designed to provide the highest quality photonics components with the greatest efficiency, accuracy and reliability. This is a semi-automated system that can be operated by one operator. It consists of two main components, the grinding-polishing head (GP head) and the lapping plate module. The grinding-polishing head is equipped with both grinding and polishing media which can be adjusted to provide the desired level of finish with an abrasive depth of 0.2-0.5µm. This head can also be programmed to allow for an array of grinding and polishing parameters as well as a fully automated process with minimal manual intervention. The lapping plate module is a highly advanced unit that allows for quick and precise polishing of a variety of substrates. It features a unique 3-axis design to allow for fast and accurate results with the greatest degree of control. The machine also includes a pressure distribution tool which allows for uniform and consistent pressure to the entire lapping plate. FS 60 Compact is designed to deliver the highest quality surface finish and finest surface polishing. This asset is capable of achieving a surface quality of 0.1 nm and a surface roughness of 0.01 nm Ra. The extremely accurate polishing process and the high level of quality givefor an improved surface profiling quality which is essential for production of high quality photonics components. The model is controlled by a touch screen interface which allows for easy programing of parameters and operation at the touch of a button. The equipment also features an automated process log which allows for tracking performance data via a Windows-based software. The automated process log data can be used to track and analyze the system's performance. GEIBEL HOTZ FS 60 Compact is an advanced and reliable unit, suitable for a wide range of applications including optical component manufacture, semiconductor industry, telecommunications, photolithography and other scientific applications. It is a reliable, robust and efficient machine that allows for easy and efficient wafer grinding, lapping and polishing, resulting in superior quality photonics components.