Used GER CU-1000 #9052574 for sale

GER CU-1000 is a wafer grinding, lapping & polishing equipment designed to serve a wide range of needs. It is suitable for many materials from ultra-hard to ultra-soft. It can handle the grinding and lapping of ceramic, semiconductor, glass, ferrite, quartz, fused silica, nitride, and a variety of other materials. The system is composed of two independent processing stations, a controlled-force positioning table, and a pneumatic pressure platen. The grinding and lapping processes are controlled from one easy-to-use computer interface. The software allows users to pre-program and store recipes for each job. The process demands can be monitored and programmed to adjustable limits. The overall pressure of the grinding and lapping process can be controlled and maintained with the pressure platen, and the range of motion of the grinding wheels and platen can be independently adjusted to meet the process requirements for specific applications. The unit also features a proven "dynamic loading adjustment" to adjust the load of the grinding wheels to keep them balanced for each pass, ensuring an optimal quality process. The platen can also be adjusted to provide quality grinding of thin wafers. In addition, a vacuum machine is provided to ensure a dust-free environment and reduce the risk of contamination. CU-1000 utilizes a wet-grinding process, meaning that the whole process is carried out in a coolant-filled tank, preventing thermal damage to the sample. The tool is also automated, meaning that the parameters of material removal and complexity of the process can be easily and accurately programmed and monitored. GER CU-1000 is designed to be safe and reliable. It is equipped with EMF and vibration monitoring systems to detect any potential torques, vibrations, or other sources of aberrations that could be damaging to the sample or the asset. Also, it is designed with an energy-saving motor, cooling systems, and exhaust ventilation to reduce energy consumption and noise levels. Overall, CU-1000 is a powerful and reliable wafer grinding, lapping & polishing model. It is designed to provide precise and reproducible results consistently and quickly, making it a valuable tool for applications where the highest degree of accuracy and repeatability is required.