Used GIGAMAT 3826 #9143786 for sale
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ID: 9143786
Spare parts:
(17) Wafer template for 8"
(9) Wafer template for 4"
(191) Insert for 3" wafer
(163) Insert for 6" wafer
(40) Insert for 8" wafer
(4) Red shims for 3" wafer
(1193) Red shims for 2" wafer
(219) Red shims for 4" wafer
(123) Red shims for 8" wafer
(86) Yellow shims for 8" wafer
(28) Green shims for 8" wafer
(28) Transparent shims for 8" wafer
(45) Green shims for 8" wafer
(19) Transparent shims for 4" wafer
(19) Yellow shims for 4" wafer
(6) White shims for 6" wafer
(21) Transparent shims for 6" wafer
(77) Filter bag
(46) Yellow shims for 6" wafer
(8) Red shims for 6" wafer.
GIGAMAT 3826 is a powerful wafer grinding, lapping and polishing equipment made for semiconductor applications. At the core of 3826 is a LoadLock cassette loader connected to a grind-lasp-pol platform which houses powerful grinding and polishing heads. This setup provides quick sample loading and unloading as well as high micro-finishing capability. Advanced wafer clamping and drive systems ensure reliable grinding and polishing with precise control over them. The high degree of control and precision, combined with the latest variable frequency drive technology, enables GIGAMAT 3826 to achieve optimal surface finish results. This makes it the perfect choice for sensitive wafer production applications. Grind heads are powered by 6.6 kW brushless motors and feature advanced spindle stiffness and vibration dampening for high precision and repeatability. An optional DC 6.6 kW turbomotor is also available for maximum grinding power. The system also features a low inertia Rapid Change unit (RCS) for quick tool changeover and a Powder Recirculation Machine (PRS) for efficient grinding dust collection. 3826 lapping and polishing platform has two ultrasonic lapping heads, capable of up to 5kHz amplitude, adjustable up to 12 kHz. The powerful 75HP ac servomotor is incorporated to drive the lapping tool in a precise circular motion and provides superior consistency in multiple-lapping processes. An advanced control tool ensures repeatable results. For polishing, GIGAMAT 3826 comes equipped with an innovative pressure control asset. The model produces a perfectly even pressure at the sample using a patented three-point support equipment that is capable of maintaining pressure ranges from 5g to 500g. An intelligent control system adjusts the pressure to the sample based on its size, shape, surface finish requirements, and material. 3826 is a reliable, high-performance grinding, lapping and polishing unit made for the toughest semiconductor applications. Its advanced drive and control systems ensure repeatable and reliable results. The pressure control machine ensures even polishing pressure for consistent surface finish. This makes it the ideal choice for the most challenging production processes.
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