Used GLINT GSG-1020AHD #170023 for sale

GLINT GSG-1020AHD Wafer Grinding, Lapping & Polishing Equipment is an innovative, precision machine tool specifically designed for advanced wafer grinding, lapping and polishing applications. Its unique combination of speed, accuracy and flexibility make it the ideal system for producing consistently high quality wafers. GSG-1020AHD is a two-station unit capable of grinding, lapping and polishing 300mm, 450mm and 525mm semiconductor wafers. It is equipped with an intuitive touchscreen monitor, programmable software and a powerful 1 HP motor for precise control, precision alignment, and fast setup. The machine uses a combination of diamond and alumina grinding wheels to achieve superior surface planarity on a wide variety of materials, including stainless steel and glass. The grinding wheels have a rotation range between 100 and 4,000 RPM, allowing for maximum flexibility while fine grinding. The tool also has lapping capabilities, using internally generated slurries generated by external slurry tanks. The lapping process can be used to achieve a wide range of roughness and finish on a variety of materials, and it can be adjusted to provide different sizes and types of cuts and grooves. Finally, GLINT GSG-1020AHD is equipped with a polishing head, capable of providing polishing to SEMI F-47 and MIL-P-5514 standards. The polishing head has an adjustable variable speed from 0 to 600 RPM, and its adjustable stroke length allows for precise polishing control. In conclusion, GSG-1020AHD Wafer Grinding, Lapping & Polishing Asset is a reliable and effective way to achieve high quality wafers. With its intuitive controls and powerful motor, it provides superior precision, accuracy, and flexibility for a variety of grinding, lapping and polishing applications.