Used GMN MPS 2 R300 DS #9133730 for sale

GMN MPS 2 R300 DS is a wafer grinding, lapping, and polishing equipment designed to provide maximum flexibility and advanced technology for modern semiconductor wafer processing. It features a robust and reliable design that is capable of providing excellent wafer grinding, lapping, and polishing performance. The system is comprised of two interconnected modules, including a grinding and lapping module and a polishing module. The grinding and lapping module is designed for wafer cutting, thinning, and grinding, while the polishing module is designed for post-grinding surface finishing for accurate and controllable wafer planarity and surface roughness control. The modules are installed side-by-side and communicate using a CANbus network. The grinding and lapping module is equipped with a high-powered, direct drive spindle that is capable of up to 200,000 RPM with a power up to 50 HP. The powerful motor ensures clean cuts and offers precise grinding and lapping operations. A high-precision linear motor drive and 3D CNC control allow for sophisticated three-axis control and unparalleled accuracy. The spindle is also equipped with an internal cooling unit for thermal control. The polishing module is equipped with a precision designed and constructed polishing head that is capable of achieving highly accurate, uniform surface finish. The polishing head is powered by a high-powered linear motor drive and 3D CNC control machine that allow for three-axis control. The polishing head is equipped with integrated polishes to provide optimal surface finish and high-precision polishing even at high production speeds. GMN MPS 2 R300DS is designed for laboratory and production environments offering outstanding performance and flexibility. It is the ideal choice for high-precision wafer grinding, lapping, and polishing operations. The tool is equipped with in-line, non-destructive optical metrology tools and a real-time data acquisition asset that allows you to monitor the process in real time for a better understanding of the wafer process.