Used GMN MPS 2 R300 #293621762 for sale

GMN MPS 2 R300 is a wafer grinding, lapping & polishing equipment designed to make the entire semiconductor production process easier and more efficient. The system works by utilizing a combination of advanced grinding, lapping, and polishing techniques to produce high-quality, high-precision surfaces. The main advantage of MPS 2 R300 is its low-cost production method, which significantly reduces manufacturing costs while maintaining the highest levels of accuracy and quality. The unit features a simple, yet powerful mechanical design with a high-speed grinding spindle, which allows for quick and accurate grinding of wafer surfaces. Additionally, the spindle is equipped with a protection mechanism that prevents any damage to the wafer surface. The lapping operation is performed by two spindles equipped with a flexible abrasive belt. The belt is able to produce a high-precision surface finish while maintaining a low profile. After lapping, the wafers are polished with a polishing belt. The belt is designed to minimize scratches and generate a highly reflective mirror-like finish. The machine is designed to be user-friendly, with a touch-screen display that allows for intuitive operation. Additionally, a range of process parameters are available for optimization, these include wafer grinding speed, operation pressure, abrasive belt and polishing belt selection, and more. Finally, GMN MPS 2 R300 tool offers enhanced safety features with its motor overload protection, over-voltage protection, and shock-resistant housing which are designed to keep operators free from injury. All in all, MPS 2 R300 wafer grinding, lapping & polishing asset is a powerful and efficient solution for producing high-precision surfaces on semiconductor wafers. The model provides an excellent combination of accuracy, cost-effectiveness, and user-friendliness that makes it an ideal choice for the semiconductor industry.