Used GMN MPS 2 R300 #293650837 for sale

GMN MPS 2 R300 is a highly efficient wafer grinding, lapping and polishing equipment designed to precisely process semiconductor and optoelectronic wafers to the highest quality standards. Incorporating advanced process control, MPS 2 R300 provides an automated material preparation solution for replicating and preparing the exact surface properties required. The system is capable of handling wafer sizes up to 300mm, as well as processing a wide range of substrates such as silicon, gallium arsenide and indium phosphide. It is equipped with a positional accuracy of 0.05 μm and a speed control accuracy of 5 μm/sec which ensures high precision machining. GMN MPS 2 R300 is equipped with a dual side grinding unit that includes two independent profile grinders. The profile grinders feature a rotating feed-adjustable grinding and lapping spindles with a dynamic water-cooling machine to ensure that the wafers are worked quickly and accurately. The tool also features an automated sub-surface lapping asset to further condition the surface. This enables MPS 2 R300 to create high precision surfaces with superior form accuracy. To ensure maximum homogeneity and surface finish, the model is also equipped with an advanced polishing solution that is capable of processing both flat and tapered wafers. This includes high pressure polishing, ultra-precision polishing, and chemical-mechanical polishing (CMP) with adjustable pressure, speed, and chemical mixture capabilities. This allows for highly accurate finishing processes on a variety of substrates. GMN MPS 2 R300 also contains a final cleaning station. This station provides accurate and consistent surface preparation by removing any foreign particles or debris from the surface. Overall, MPS 2 R300 is a versatile and highly efficient equipment designed to meet the most demanding requirements of precision surface preparation. With its advanced automated process control and integrated polishing solutions, GMN MPS 2 R300 enables the perfect preparation of a wide range of wafer sizes and substrates for the highest quality results.