Used GMN MPS 400 #9041582 for sale

GMN MPS 400 is a high-precision wafer grinding, lapping and polishing equipment designed for processing a range of different materials. It features a large, heavy-duty, closed-loop drive base with 360° variable speed adjustment guarantees quality grinding to sub-micron level. The system employs an integrated turning table to ensure accurate and rigidly fixed angles to ensure proper grinding and polishing results. The spindle is driven by a servo-controlled frequency converter to provide the highest level of accuracy and reliability. The unit boasts a maximum capacity of 400 mm in diameter and an impressive grinding depth of 4mm. The machine is designed to ensure optimal productivity and performance. Its linear drive tool and the rigid granite base ensure highly precise and stable processing operations. The combination of the advanced software-controlled grinder and the direct drive high frequency lapping device ensures perfectly matched components. The precise grinding and polishing heads yield precise results in minimal time. The smart-designed cooling asset avoids any material aging while lapping. The vacuum-assisted polishing and grinding heads reduce the build-up of abrasive and metal particles. The innovative dry-grinding/polishing model and its standard accessories offer a single-unit solution to surface treatment. They can be applied to materials such as sapphire, silicon, ceramics and multilayer germanium. Additionally, the diamond grinding discs, deburring stones and flaps can be used to polish the internal sides of the wafers. The user-friendly, ergonomic design with a 19-inch touchscreen interface and intuitive fingertip navigation ensures that MPS 400 is easy to use and offers a fast learning curve. The equipment contains an automated process reporting system for quality and efficiency control. It features patented grade detection technology, auto-centering for wafer handling and a speed stability management unit. In summary, GMN MPS 400 is an effective, energy-efficient and user-friendly wafer grinding, lapping and polishing machine with a high-capacity, wide range of potential applications and options. The combination of efficient technology, comprehensive software-oriented features and quick setup and optimization ensures the tool is capable of delivering excellent surface quality and precision grinding throughout a range of materials.