Used GUANGDONG FUSAN FXM-10 / FPG-13 #9093628 for sale

GUANGDONG FUSAN FXM-10 / FPG-13 is a wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. The machine uses a precision-ground diamond tool, supporting the abrasive material, mounted on a rotary table. The table rotates at low speed (typically below 1000 RPM) allowing the diamond tool to effectively grind, lap and polish more material with less effort. It is designed to minimize downtime with an automatic loading/unloading system, allowing the machine to switch between grinding, lapping and polishing wafers quickly. The machine includes a two-axis programmable controller, enabling easy control and optimization of the grinding, lapping and polishing parameters. An optional Programmable Logic Controller (PLC) allows for further customization of the operational parameters. An integrated spindle unit provides excellent accuracy and repeatability, with the option to upgrade to a multi-spindle machine for increased speed and efficiency. FXM-10 / FPG-13 is equipped with a high-precision, repeatable grinding suspension tool, utilizing two adjustable tensioning bars, ensuring an even, smooth surface finish. The asset is designed to grind and lap wafers of variable size and thickness, with a top tolerance of 100 nm. The grinding and lapping process is monitored using a 60x microscope with a digital display. The machine also features a polishing head with built-in load cell and fluid-loading/unloading control, designed for polishing thin-film structures or other advanced substrates with precision and repeatability. The polishing head is mounted on a high-speed, direct-drive motor, allowing for quick adjustment of the force and speed of the polishing process. GUANGDONG FUSAN FXM-10 / FPG-13 is a combination of precision grinding, lapping and polishing processes, delivering a complete solution for semiconductor fabrication. Its advanced control, suspension and polishing systems enable it to produce high-precision wafers with superior surface quality. It is an ideal solution for applications such as advanced packaging substrates, display glass, and MEMS/optoelectronic materials.