Used GUANGDONG FUSAN FXM-10 / FPG-9 #9093631 for sale

GUANGDONG FUSAN FXM-10 / FPG-9 is a wafer grinding, lapping and polishing equipment specifically designed for semiconductor applications. This system is ideal for use in high-volume manufacturing environments and offers an unparalleled level of precision and accuracy. FXM-10 / FPG-9 boasts a highly efficient design, featuring a series of die-mounted grinding, lapping and polishing stations. This enables fast, precise machining of wafers up to 4 inches in diameter. GUANGDONG FUSAN FXM-10 / FPG-9 is equipped with a pneumatically-operated die-mounted grinding head, that operates at speeds of up to 10,000 rpm for precision grinding of wafers. This unit also features multiple lapping/polishing stations with both diamond and cerium oxide abrasives, as well as a deionization unit to maximize the stability of the diamond abrasive. It is also capable of handling different size wafers by adjusting the gap between the grinding/polishing platters. FXM-10 / FPG-9 provides precise, repeatable results, and has been designed to meet tight manufacturing requirements. The machine allows for highly accurate, consistent results across the entire batch of wafers, and is specifically designed to reduce the cost of wafer processing. The controls of the tool enable remote monitoring and adjustments, meaning that the asset can be maintained and checked for quality even while in operation. This allows for run-to-run feedback and optimization, meaning that the quality and uniformity of the wafers can be continuously improved. GUANGDONG FUSAN FXM-10 / FPG-9 is a versatile model that is designed for use in a wide variety of semiconductor manufacturing applications. The simple design of this wafer grinding, lapping and polishing equipment means that it is easy to maintain and operate, making it ideal for use in a variety of different production environments. FXM-10 / FPG-9 is the perfect tool for achieving maximum wafer processing speed and accuracy, while reducing the cost of production.