Used HAMAI 15BF-5P-2M #9208862 for sale

HAMAI 15BF-5P-2M is an automated, CNC-controlled wafer grinding, lapping and polishing equipment designed for the efficient grinding and polishing of a variety of materials such as semiconductor wafers, quartz, polycrystalline and single-crystal substrates, wafer packages and other high-precision components. This system offers a highly precise and reliable solution for demanding grinding, lapping, and polishing applications. 15BF-5P-2M is ideal for preparing wafer surfaces for bonding, coating, fluxing, and molybdenum preparation. HAMAI 15BF-5P-2M is built around a 15″ worktable with three axes of motion (X, Y, and Z) for wafer-to-wafer processing capability through the use of two rotary axes. A spindle drive powered by a brushless DC motor allows up to 5hp peak output and up to 2000rpm rotation for the most efficient grinding, lapping, and polishing of abrasive parts. For maximum workpiece rigidity and control, the used spindle can be head mounted on a durable, precision-ground, cast aluminum table. The X-Y travel range of the table is 200mm and the Y-Z range is +- 30°. 15BF-5P-2M also features a dual-directionally adjustable oil mist coolant unit that can be used to lubricate the workpiece and cool it down during the grinding, lapping, and polishing process. The lubricant used can be self-generated oil mist or a specialized lubricant from an external source. Additionally, a temperature monitoring machine can be integrated with the tool to monitor the temperature of the coolant and workpiece during the processing. For operation and control, HAMAI 15BF-5P-2M is equipped with an industrial PC, touchscreen monitor, and a asset software for monitoring the process parameters. This model offers an intuitive graphical user interface (GUI) for quick and easy setting of process parameters such as grinding amount, spindle speed, coolant velocity, and coolant temperature. 15BF-5P-2M is also provided with a sophisticated safety equipment to help protect operators from possible accidents. In conclusion, HAMAI 15BF-5P-2M is a cost-effective and reliable system to achieve superior quality grinding, lapping, and polishing of precision parts and components. It features an easy-to-use graphical user interface, an adjustable oil mist coolant unit, and a temperature monitoring machine to ensure optimum performance and maximum safety. 15BF-5P-2M is an ideal choice for any production line requiring precise and repeatable grinding, polishing, and lapping performance.