Used HAMAI 16B-2M #9257688 for sale

HAMAI 16B-2M wafer grinding, lapping and polishing equipment is a multi-function machine capable of grinding, lapping and polishing semiconductor wafers with a minimum diameter of 4-inch to 5-inch. The system is equipped with a wide range of grinding and polishing tools to adapt to the needs of varying materials. 16B-2M is composed of a metal base with a rotating axis adorned with grinding and polishing disks. A heavy-duty electric motor is attached to the main frame and provides the primary power source to drive the rotating spindle. The motor is capable of producing rotation speeds of up to 6,000 rpm. The manually operated chucking controls enable precision alignment of the wafer onto the disks. The grinding process involves the abrasion of the wafer by grits of specially treated diamond, silicon carbide, and mixed sandy-grit, to shape and prepare the surface. This step can be followed by lapping using abrasive slurries, which further reduce the surface roughness. The lapping step is made possible by the advanced slurry dispensers of HAMAI 16B-2M, which allow for the application of a cooling or lubricating liquid to the abrasive media. The unit is able to control the pressure applied to the wafer surface during lapping, to better understand the responses of the wafer material to the variables of the grinding and lapping processes. The final stage of processing is polishing, wherein intricate patterns are imparted to the wafer surface. 16B-2M features a wide range of polishing media such as diamond pastes, polyurethane encoders, and other abrasive media. The machine is equipped with high-precision metrology capabilities to evaluate the surface condition of the wafer after each operation. HAMAI 16B-2M is a reliable and easy to operate tool, capable of handling a variety of materials with precision. Its advanced features make it an ideal choice for manufacturers and research and development professionals interested in optimising the performance of their semiconductor wafers.