Used HAMAI 16B-5L/P #9073247 for sale

ID: 9073247
Double-side lappers / polishers (4) Motors.
HAMAI 16B-5L/P is a wafer grinding, lapping and polishing system constructed to deliver high-precision, high-productivity, and low-cost flat substrates. The machine utilizes a combination of grinding, lapping and polishing, delivered in a dynamic way for a superior substrate finish. It features a fully-automated production with manual functions available for quick and easy editing. The machine operates with an 8-inch rotating table offering speeds up to 50rpm and torque up to 27 inch-lbs. The two table positions offer coarse and medium grinding with multi-task grinding capability. The 16B-5L/P features a 4-axes motion control system, allowing for high speed multi-direction grinding and lapping. The machine also equips a 5-inch throat for fast loading and precise process control. The machine is designed with a customizable grinding, lapping and polishing process. The grinding and lapping process can be customized according to the required surface finish and roughness. The machine is designed to work with various substrates such as glass, quartz, and sapphire wafers up to 8-inch diameter. It can be configured to participate in each step of the polishing process including grinding, lapping, and final polishing. The machine consists of two parts - the LCD control panel with touch screen and a "B-type" having brush backside and polishing motor for uniform and controlled polishing action. The machine is designed to be integrated with a wet or dry grinding process, thus allowing exceptional flexibility, since the user can choose to use either process depending on the job at hand. The LCD control panel also allows you to set grinding, lapping and polishing parameters and monitor the process step-by-step. HAMAI 16B-5L/P offers several advantages over traditional wafer grinding, lapping and polishing methods, such as enhanced machine performance, increased productivity, and low-cost substrates. The machine provides higher accuracy during polishing and reduced operational costs, as it allows users to choose between wet or dry processes according to the job. Furthermore, its customizable processes guarantee the desired surface finish and roughness.
There are no reviews yet