Used HAMAI 16B-5P #9073248 for sale

HAMAI 16B-5P is a high-accuracy wafer grinding, lapping, and polishing equipment designed to deliver the highest levels of surface finish and flatness for semiconductor wafers. This system offers two modular configurations. 16B-5P-SG is designed for standard wafer grinding and polishing processes, while HAMAI 16B-5P-HG offers premium high-precision grinding and polishing. This unit is designed to maximize production throughput, while minimizing contamination and variation. 16B-5P features a five-piece cassette machine which provides an efficient and contamination-free wafer exchange. Multiple polishing and grinding discs are available for a wide range of process applications. These discs are easy to change, and the tool can be completely automated for high-volume production. HAMAI 16B-5P utilizes a high-precision SCARA robotic arm, allowing for precise motion control of the grinding/polishing wheel. The16B-5P also features a unique means of wafer loading and unloading, which eliminates the need for manual intervention. 16B-5P is a fully enclosed asset featuring a high-capacity exhaust model to ensure a clean working environment. The enclosure is equipped with a filter and vacuum equipment to remove debris. This system is capable of producing ground and polished wafers with superior surface finish and flatness. It is also capable of producing wafer with up to 8 micron RMS finish. HAMAI 16B-5P is equipped with extreme vibration isolation to reduce the chances of wafer breakage and introduce low noise into the unit. The machine is also designed with mechanical protection for the wafers to prevent accidental damage. The tool is equipped with a data logging asset which enables you to monitor the wafer profile and process parameters in real-time. It also provides an easy-to-read graphical interface for monitoring and controlling the model's functions. This equipment also features a unique automated wafer tracking system which can monitor the wafer's position for optimal process capabilities. 16B-5P provides a reliable, high-precision, and contamination-free process for the production of high-quality semiconductor wafers. This unit is capable of producing wafer with superior surface finish and flatness and is designed for maximum productivity and throughput.