Used HAMAI 16B #293776094 for sale

HAMAI 16B wafer grinding, lapping and polishing equipment is specifically designed for precision surface and edge preparation of rigid and fragile substrates. With its 3-axis drive stage, the system utilizes two independent grinding and polishing heads, each with its own servo-drive motor, to produce superior surface quality. Its controllable force and variable speed settings, combined with a standard vacuum table, allow for precise control over the grinding, lapping and polishing process. The machine can be outfitted with a wide selection of lapping and polishing heads with sizes ranging from as small as 50 mm up to as large as 300 mm. All lapping and polishing heads come equipped with four differently sized platens and six differently sized erasers. Additionally, the lattice-like structure of the table surface ensures that intricate shapes and sizes that would otherwise be difficult to work on are accommodated without sacrificing accuracy or precision. HAMAI 16 B includes a powerful, easy-to-use graphical user interface connected to its embedded controller. The controller is capable of controlling the complex motions and force settings of the motorized grinding and polishing heads. It also allows for interactively setting the speed, force and dwell time for each of the lapping and polishing heads. Any desired process recipes are entered into the controller, making it completely automatic and able to repeat the same process for different parts. The unit can handle substrate materials ranging from brittle semiconductors to hard ferrous metals. It produces superior surface finishes and edge sharpness that are superior to manually buffed surfaces, as well as a consistent surface quality that is critical for wet chemical processes. The machine is also equipped with a built-in post-processing cleaning machine that removes residual abrasives and debris from the substrate after the lapping and polishing process is complete. Overall, 16B is an industrial-grade wafer grinding, lapping and polishing tool that is capable of delivering superior surface finishes and edge sharpness that meet exacting standards while saving time and resources over manual processes. Its intuitive user interface, powerful controller, and wide range of accessories make it the ideal choice for any semiconductor research and development or production environment.