Used HAMAI 16B #9205541 for sale

HAMAI 16B is a state-of-the-art wafer grinding, lapping and polishing equipment for semiconductor manufacturing applications. It has been designed with accuracy, speed and quality in mind, allowing users to quickly, accurately and reliably grind, lap and polish semiconductor wafers. HAMAI 16 B is built around four main components consisting of a spindle, main body, slide table and base frame. The spindle is a precision-machined, stainless steel shaft designed to hold wafers securely in place while rotating at high speed with little vibration. The main body is a high-grade steel and aluminum component which houses the spindle, bearings and motor. It is designed to maintain optimal accuracy at high rotational rates. The slide table is a stainless-steel plate that slides along a track for precise positioning of wafers to ensure maximum grinding and finishing precision. The base frame acts as a housing for the spindle, main body, slide table and motor. It also provides mechanical strength and stability to the entire system. 16B is equipped with user-friendly software that allows for quick and easy setup and operation. It has large storage capacity for grinding and lapping settings and variables along with a built-in back up unit for data recovery. In addition, its advanced motion control capabilities make it easier to properly pattern wafers for uniform results. For increased safety, 16 B has three shock absorbers and a vibration dampening machine. These help reduce noise and vibrations and prevent machine damage. It is also equipped with dust filters and wet scrubbers to reduce wear on the wafers. Overall, HAMAI 16B is a reliable and secure solution for wafer grinding, lapping and polishing. The combination of its advanced features, user-friendly software, safety mechanisms and reliability make it one of the best solutions available for semiconductor wafer processing.