Used HAMAI 16B #9217161 for sale

HAMAI 16B is a wafer grinding, lapping and polishing system designed for use in the semiconductor industry. It is capable of producing flat, smooth, and defect-free wafers with extremely high accuracy and repeatable results. The machine consists of multiple components, including a grinding unit, lapping unit, and two polishing units. The grinding unit works to reduce the size of the wafer, removing excess material according to the desired specifications. It works by removing a thin layer of material from the face of the wafer, using abrasive particles. The grinding is precise and repeatable due to the high-speed grinding wheel, which has been designed to maintain a consistent speed. It is also equipped with a vacuum to ensure dust and debris are properly removed. The lapping unit is responsible for providing the required polish. It uses a combination of diamond and diamond-impregnated wheels to quickly and precisely shape and finish the surface of the wafer. This process increases the surface area without sacrificing accuracy. The lapping unit is also equipped with a vacuum to ensure debris is removed. The polishing units are responsible for providing the required polish. The first polishing unit uses diamond-impregnated wheels to provide an extremely even finish. The second polishing unit is equipped with an ion beam mechanism which further polishes and smoothes the surface of the wafer. Overall, HAMAI 16 B is a highly advanced and reliable system for producing high-precision, defect-free silicon wafers. It is capable of delivering superior results in terms of performance and quality. Furthermore, its versatility ensures it can be used in a wide variety of applications. Its combination of cutting-edge technology and user-friendly design make it an ideal choice for modern semiconductor manufacturing.