Used HAMAI 16B #9252227 for sale

HAMAI 16B is an advanced wafer grinding, lapping, and polishing equipment designed to provide high precision finished wafer surfaces with unparalleled consistency and quality. This system utilizes a unique two-stage grinding process for both planar and curved surface applications, allowing for a wide variety of substrate metal finishing, including low, medium, high-density, and ultra-high density wafer projection correction and polishing (PPCP). HAMAI 16 B unit is built with heavy duty cast iron components and pre-loaded servomotors for smooth, accurate motion control. A digital, closed loop temperate control machine is also included for precise temperature monitoring and feedback for optimal performance. Its two-stage grinding tool involves a precision swing-arm design with constant-torque, variable angle grinding heads and swing arm motor speeds to ensure swift yet exact wafer surface modulation and finishing. This asset is capable of producing components with ultra-low surface roughness requirements, tolerances up to ±1nm pitch accuracy, and has a die-size rejection range of 70µm or less. 16B also features an adjustable grinding wheel speed for delicate low-stiffness, ultra-thin, stacked layers of semiconductor materials. The wheel speed can be adjusted from 10-250rpm, and is equipped with water-cooling to prevent substrate temperatures from getting too high. The model is also equipped with a monochromatic metrology equipment that ensures the accuracy of finished wafer features, making this machine ideal for a variety of increasingly demanding fabrication and applications. With an operation environment temperature range of 0 to 40°C and a relative humidity range of 20% to 80%, this grinding and lapping machine is the perfect all-rounder for getting the job done.